High precision weighing represents a key factor for achieving optimal efficiency in the manufacturing processes in all industrial sectors. The EC-E-VA model is built entirely of stainless steel to complement the successful ESSENTIAL series.
At PCI we combine knowledge, experience, and innovative technologies to provide our customers packaging services that ensure safety and reliability throughout.
Skyworks introduces the SkyOne® Ultra 2.5 as its newest SkyOne® front-end solution targeting the high growth China LTE market. This fully-integrated multiband module includes both global and region-specific architectures that provide OEMs with the ability to leverage the same printed circuit board across multiple smartphone platforms in diverse-end markets. SkyOne® Ultra 2.5 solutions are composed of the following:
CDISC Express is the solution of choice for advanced clinical SAS programmers to convert clinical data into CDISC SDTM (Study Data Tabulation Model) standards. CDISC Express is a powerful SAS®-based mapping tool that streamlines and automates the SDTM data conversion process. CDISC Express follows the new SDTM 3.1.3 specifications, and includes the latest SDTM medical device domains released by the CDISC organization.
The right employee development and education can provide payoffs for employers in increased productivity, knowledge, loyalty, and contribution. Technical learning services offer you training direct from the manufacturer with dedicated teaching professionals, world-class training workstations, and proven, audience-based curriculum. These training programs provide a competitive advantage through hands-on practical application of the competencies critical to your goals.
The FLIR X6800sc is a fast, highly sensitive MWIR camera designed for scientists, researchers, and engineers. With advanced triggering and on-camera RAM/SSD recording, this camera offers the functionality to stop motion on high-speed events both in the lab and at the test range. The X6800sc has a cooled FLIR indium antimonide (InSb) detector and captures full 640 x 512 images at 502 frames per second, or up to 29,134 Hz with windowing.
Forget everything you know about desktop scanning.
Advanced software delivers advanced workflow solutions and a complete set of tools for creating, executing, and optimizing business processes. 100% embeddable web-based architecture and strong integration capabilities ensures collaboration throughout the Enterprise.
Caplugs has been a global leader in plastic molding with six different molding processes and thousands of material options. The in-house team of engineers works with customers throughout their comprehensive process to design a unique solution process from creating concepts and rapid prototyping to packaging and inventory management.
SCHOTT Electronic Packaging offers the HermeS® glass substrate wafer with hermetically sealed solid “Through Glass Vias” (TGV) designed to enable fully gastight and long-term robust enclosures for MEMS devices such as industrial hermetic MEMS sensors, medical MEMS, and RF MEMS. It features fine-pitched vias that allow for reliable conduction of electrical signals and power into and out of MEMS devices.
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